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quality BOURNS SM453229 231N7Y 10 100 1000 Base T PoE Plus Chip LAN Transformer with EMI Reduction Capability factory
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quality BOURNS SM453229 231N7Y 10 100 1000 Base T PoE Plus Chip LAN Transformer with EMI Reduction Capability factory
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Specifications
Inductance:
200uH
Operating Temperature:
-40℃~+85℃
Turns Ratio:
1:1
rate:
10/100/1000 Base-T
Mfr. Part #:
SM453229-231N7Y
Package:
SMD-7P,4.7x3.3mm
Key Attributes
Model Number: SM453229-231N7Y
Product Description

Product Overview

The SM453229-231N7Y is a 10/100/1000 Base-T PoE+ Chip LAN Transformer designed for flexible PCB layout with discrete transformers and common mode chokes. It offers an expanded operating temperature range of -40 to +85 C and is RoHS compliant. This transformer is ideal for applications requiring reliable Ethernet connectivity with Power over Ethernet Plus (PoE+) capabilities. It can be paired with the common mode choke SRF2012A-801Y for enhanced EMI reduction.

Product Attributes

  • Brand: Bourns
  • Compliance: RoHS compliant*
  • Certifications: IEEE 802.3 Ethernet compatible

Technical Specifications

Specification Value
Model SM453229-231N7Y
Type 10/100/1000 Base-T PoE+ Chip LAN Transformer
Inductance @ 100 kHz, 0.1 V, 0 mADC (Pin 1-2 & 6-7 / short 3-4) 230 H min.
Inductance DC Bias @ 100 kHz, 0.1 V, 15 mA DC (Pin 1-2 & 6-7 / short 3-4) 200 H min.
Turns Ratio ( 3 %) (Pin 1-2 : 6-7 / short 3-4) 1 : 1
Insertion Loss (1-100 MHz) -1.5 dB max.
Capacitance (Pin 5-3 / short 3-4) 35 pF typ.
Hi-Pot (Pin 1 to 6, short 3-4) 1500 VAC, 60 sec.
Operating Temperature -40 to +85 C
Storage Temperature -40 to +85 C
Packaging 2000 pcs. / reel
Dimensions (L x W x H) 4.70 0.20 mm x 3.30 0.20 mm x 2.90 mm MAX.

Dimensions

(Refer to the provided diagram for detailed dimensional drawings in mm and inches)

Electrical Schematic

(Refer to the provided diagram for the electrical schematic)

Recommended Pad Layout

(Refer to the provided diagram for recommended pad layout in mm and inches)

Soldering Profile

(Refer to the provided diagram for soldering profile information)

Packaging Specifications

(Refer to the provided diagram for packaging specifications)

*RoHS Directive 2015/863, Mar 31, 2015 and Annex.

Specifications are subject to change without notice. Users should verify actual device performance in their specific applications.


2411272342_BOURNS-SM453229-231N7Y_C6816858.pdf

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